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SanDisk Partners with NVIDIA to Deliver Worlds Fastest Tablet Reference Design

SanDisk and NVIDIA announced today at the Barcelona Mobile World Congress 2013 that the iNAND Extreme Embedded Flash Drive (EFD) supports Tablet reference designs based on the NVIDIA Tegra 4 – the world’s fastest mobile processor. The iNAND Extreme is optimized for use in the Tablets powered by Tegra 4. The reference design assist Tablet manufacturer with developing powerful new Tablets. With tens

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Gartner Test 9 Scale-Out NAS File System Storage

Published on February 23, 2013, in Enterprise.

Garter released today the result of a Critical Capabilities for Scale-Out File System Storage report testing 9 of the leading industry systems from Dell, EMC, Hitachi, HP, IBM, NetApp, Nexentra, Quantum and Red Hat. Building scalable and cost-effective storage infrastructure for big data is a key imperative for IT leaders. This research compares nine scale-out file

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Micron Talks About the Future of Embedded Medical Memory

Micron held a Memory for the Interconnected World Webcast of February 21, 2013 where they talked about their Embedded Memory business and market condition in this series of articles I will cover the different Embedded market that Micron is pursuing. The medical space is the second fast growing Embedded market, in the medical space. interconnected helps

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Micron Talks About the Future of Embedded Automotive Memory

Micron held a Memory for the Interconnected World Webcast of February 21, 2013 where they talked about their Embedded Memory business and market condition in this series of articles I will cover the different Embedded market that Micron is pursuing. The main driver for the growth in Embedded Memory is the interconnected systems. The two main

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Etron to Hit 10 Million USB 3.0 Flash Drive Controller Milestone in 2013

Etron Technology of Taiwan fabless IC design and product company, is expected to see its cumulative shipments of USB 3.0 Flash Drive (UFD) controllers surpass 10 million units in 2013, up significantly from the current one million units reached, according to the company. Etron indicated that the company’s recently-launched EV2669 and EV1669 USB 3.0 Flash Device controllers

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Intel’s Short Term Plans to Revive the PC Market

Published on February 21, 2013, in SSD, Tablets, Ultrabook.

PC makers are planning to launch a series of measures, including price cuts for their products, in the second quarter of 2013 to rekindle the stymied notebook industry caused by growing popularity of tablets, according to industry sources. The launch of Windows 8 has failed to ignite replacement demand for notebooks in the end markets,

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Apple Still Leads With The World’s Best-Selling Smartphone Model

“Apple’s iPhone 5 smartphone model shipped an estimated 27.4 million units worldwide during the fourth quarter of 2012,” Strategy Analytics analyst Neil Shah said. “The iPhone 5 captured an impressive 13 percent share of all smartphones shipped globally and it has become the world’s best-selling smartphone model for the first time ever.” The firm estimates that

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Samsung Plans to Sell 100M Galaxy S IV Phones

Published on February 20, 2013, in Smartphone.

Samsung’s next-generation Galaxy S IV is expected to be its most successful smartphone yet and according to a new report, it might be so big that it pulls resources away from Apple. In a note to clients on Thursday, Jefferies & Company analyst Peter Misek wrote that Samsung plans to build 100 million units of its upcoming flagship Android phone. According to

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OCZ Technology Delivers Vertex 3 With 20 Nanometer Flash

Published on February 19, 2013, in SSD.

OCZ Technology unveiled today the latest version of its Vertex Solid State Drive consumer SSD dubbed 3.20. The drive uses the latest LSI SandForce 2200 controller and supports the latest MLC NAND Flash geometries from Samsung, Hynix and Micon to cut down on product cost. The Vertex 3.20 uses synchronous NAND MLC 20nm Flash optimized for 4K random writes supporting read

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Micron Launches World Smallest 20nm Dense 128-Gbit TLC NAND Flash

Published on February 19, 2013, in Press Release.

In January 2012, Toshiba finally began manufacturing its 19nm NAND Flash on 3-bit-per-cell (TLC) 128Gb chips with the world’s smallest die size at just 170mm2. The company has also been able to achieve the world’s fastest write speeds on any 3-bit-per-cell (3-bit-per-cell TLC) device at 18MB/s. Micron Technology Inc. (Boise, Idaho) has launched a year

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