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Intel Launch Haswell CPU to Revive PC Market

Published on June 4, 2013, in Press Release, Ultrabook.

Computex Taipei 2013, Intel today on the first day of Computex launched its long-awaited lineup of Haswell processors. The chips are designed to enable a new breed of computers based on a 2-in-1 form-factor – PCs that can turn into tablets. The 22nm Tri-Gate Haswell CPUs offering 50 percent more battery life for notebooks than Ivy

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Samsung Takes 128-Gbit Flash Memory Below 20 nm

Published on April 17, 2013, in FAB, Press Release.

Samsung Electronics has announced it has begun volume production of a 128-Gbit, 3-bit Multi-Level Cell (MLC) NAND memory using 1x-nm class process technology. Samsung defines 1x-nm class to be somewhere between 10-nm and 19-nm. Samsung claims its chip has the highest physical density and the highest performance as it can move data at 400-Mbits per

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Micron, Samsung, Hynix Agree to 3D Memory Spec

SAN JOSE, Calif. – The Micron-led Hybrid Memory Cube Consortium HMC has issued version 1.0 of its specification for a vertical memory stack with a defined logic-layer interface. Now the group will turn its focus to higher-speed variations of a dynamic random-access memory (DRAM) module stacked using through-silicon vias. In its next-generation spec, the group

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OCZ Technology Appoints Rafael Torres as Chief Financial Officer

Published on March 26, 2013, in Press Release.

OCZ names Rafael Torres, who in the past has served as the CFO of chipmaker Power Integrations and networking equipment vendor PLX Technology, its new CFO. He replaces Arthur Knapp, who announced plans to retire last August. OCZ shares spiked in the final minutes of trading today. SAN JOSE, CA – (Marketwire) — 03/25/13 – OCZ Technology Group, Inc. (NASDAQ: OCZ),

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Micron Launches World Smallest 20nm Dense 128-Gbit TLC NAND Flash

Published on February 19, 2013, in Press Release.

In January 2012, Toshiba finally began manufacturing its 19nm NAND Flash on 3-bit-per-cell (TLC) 128Gb chips with the world’s smallest die size at just 170mm2. The company has also been able to achieve the world’s fastest write speeds on any 3-bit-per-cell (3-bit-per-cell TLC) device at 18MB/s. Micron Technology Inc. (Boise, Idaho) has launched a year

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Toshiba Cuts Forecast on Global Economy Worries

Published on November 2, 2012, in Press Release.

Japan’s Toshiba Corp cut its full-year operating profit forecast by 13 percent to 260 billion yen ($3.3 billion) on Wednesday, saying the uncertain global economy weighed on its prospects. Toshiba, saw operating profit for its electronic device segment, which includes its NAND memory chip business, drop 28 percent to 27.6 billion yen ($334.23 million) in

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Google Announces $299 Nexus 4 Smartphone and $399 Nexus 10 Tablet

Despite Hurricane Sandy and the earlier event cancellation Google went ahead and unveiled the Nexus 4 smartphone and Nexus 10 tablet. Nexus 4 specs include a 4.7-inch True HD IPS Plus display with 1,280 x 768-pixel resolution, an 8-megapixel camera, a Qualcomm Snapdragon S4 Pro processor, 8GB or 16GB of internal storage, 2GB of RAM and Android 4.2 Jelly Bean. The phone starts

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Google Cancels Android Event Over Hurricane Threat

Published on October 27, 2012, in Press Release.

Google has cancelled its Android event on Monday over fears about Hurricane Sandy, the company was expected to reveal a new Nexus smartphone and tablet. In the New York City event Google was rumored to launch the successor to its Nexus branded Android Smartphone the new LG Nexus 4 smartphone, as well as a Samsung-made Nexus 10 tablet, but the

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Samsung Mass Producing High Performance 128GB Embedded NAND

Published on October 15, 2012, in Press Release.

South Korea’s Samsung Electronics has started volume production of its high performance embedded multimedia card (eMMC) 128-gigabyte (GB) embedded NAND for next-generation smartphones, tablets and other mobile devices. The new 128GB is part of the Pro Class 1500 NAND family launched in August 2012 and available in 16-, 32- and 64-GB densities. Although Toshiba Corp. has since 2010 offered 128-GB embedded NAND, the Samsung

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Micron Appoints New Head of Mobile Devision

Published on September 20, 2012, in Press Release.

Micron Technology, Inc. of Boise, Idaho announced that Michael Rayfield will join the company as vice president, Wireless Solutions Group. Rayfield left Nvidia last month after working for seven years as the vice president and general manager of the company’s Mobile Business Unit where his team developed Nvidia’s Tegra line, emerge as a serious player in the mobile processor market scoring design

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